Materials Analysis of Fluorocarbon Films for Mems Applications

In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC f i i can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasmaenhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electromechanical structures [l]. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results will be presented.